Advanced packaging (3D and chiplets)

Which is a correct advantage of glass substrates, being considered in place of organic materials for next-generation large package substrates?

  1. AThey conduct electricity well
  2. BThey are soft and easy to bend
  3. CThey have high flatness and dimensional stability, making fine wiring easier to form
Show answer and explanation

Answer: C. They have high flatness and dimensional stability, making fine wiring easier to form

Glass has a flat surface and little dimensional change or warpage with temperature, so it is expected to make it easier to form fine wiring and dense through-vias even in large package substrates. Its application to large packages for AI and similar uses is being considered.

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More Advanced packaging (3D and chiplets) questions

  1. What is the technology called that mounts optical transceiver components close to switch ICs and the like in the same package, shortening electrical wiring to reduce power?
  2. Among hybrid bonding methods, which allows only chips judged good in test to be selected and bonded to the target wafer?
  3. What are the bumps called, far smaller than ordinary solder balls, used to connect chips stacked with TSVs and to connect chips to interposers?
  4. In AI GPUs, what is the main reason the GPU chip and HBM are placed side by side on one silicon interposer?
  5. In 3D NAND, which is a correct advantage of making the memory cell array and peripheral circuits on separate wafers and bonding them together?