SiC vs GaN Power Devices: Key Differences
Silicon carbide (SiC) and gallium nitride (GaN) are both wide-bandgap semiconductors that beat silicon in power conversion: they withstand higher fields, switch faster and lose less energy. The practical split is voltage. SiC is the choice for high-voltage, high-power systems such as electric-vehicle inverters, while GaN excels at lower voltages and very high switching frequencies, such as compact fast chargers.
| Aspect | SiC | GaN |
|---|---|---|
| Band gap | About 3.3 eV (4H-SiC), compared with 1.12 eV for silicon | About 3.4 eV |
| Critical electric field | About ten times that of silicon | About ten times that of silicon |
| Thermal conductivity | High, roughly three times silicon, which makes cooling easier | Similar to silicon, lower than SiC |
| Typical device | Vertical MOSFETs and Schottky diodes | Lateral HEMTs that use a two-dimensional electron gas as the channel |
| Typical voltage range | Around 650 V to 3.3 kV, and higher | Mostly up to about 650 V |
| Switching frequency | High (tens to hundreds of kHz) | Very high (hundreds of kHz up to MHz) |
| Substrate and wafers | SiC wafers are expensive and difficult to grow | Usually grown on silicon wafers (GaN-on-Si), which is cheaper and works in silicon fabs; GaN-on-SiC is used for RF |
| Design challenges | Gate oxide reliability and the need for higher gate drive voltage | Normally-on behavior must be avoided, and the gate tolerates only a small voltage swing |
| Typical uses | EV traction inverters, on-board chargers, solar inverters, industrial motor drives, railways | Compact fast chargers and adapters, data-center power supplies, 5G RF amplifiers |
Figures are typical orders of magnitude and vary by process generation and product.