Packaging and assembly

In high-pin-count QFPs, which problem tends to occur if the lead pitch is made too narrow?

  1. AThe package emits light
  2. BSolder bridges (shorts to the adjacent lead) during mounting
  3. CThe package becomes heavier
Show answer and explanation

Answer: B. Solder bridges (shorts to the adjacent lead) during mounting

With a narrow lead pitch, solder tends to connect adjacent leads during soldering, forming bridges. Thin leads also bend easily. When even more terminals are needed, packages such as BGAs, which can place terminals on the bottom, are used.

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