Silicon wafers

Which is closest to the standard thickness of a 300 mm silicon wafer?

  1. AAbout 5 mm
  2. BAbout 100 µm
  3. CAbout 775 µm
Show answer and explanation

Answer: C. About 775 µm

The standard thickness of a 300 mm wafer is about 775 µm. Larger wafers are thicker to prevent sagging and breakage under their own weight (200 mm wafers are about 725 µm). Depending on the product, the back is ground in the back-end process to a few tens of µm.

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More Silicon wafers questions

  1. In the CZ method, what is the main purpose of controlling the ratio of pull rate to temperature gradient in the crystal (V/G)?
  2. Which is the typical method for producing high-purity polycrystalline silicon?
  3. What is a wafer called that is run through a process separately from products to check equipment condition or measure film thickness?
  4. What is the main reason silicon wafers must be very flat?
  5. Which equipment is commonly used to slice a silicon ingot into many wafers at once?