Packaging and assembly

Which organic package substrate, used in flip-chip BGAs and similar packages, is made by stacking insulating layers and fine wiring layers?

  1. ALead frame
  2. BSingle-layer ceramic board
  3. CBuild-up substrate
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Answer: C. Build-up substrate

A build-up substrate is made by adding layers of insulating resin and fine wiring one at a time onto both sides of a core layer. It can route the wiring of chips with many terminals and is used as the package substrate for processors and similar devices.

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More Packaging and assembly questions

  1. Which wire bonding method melts the tip of a gold wire with an electrical discharge to form a ball, then bonds it to the electrode with heat and ultrasonic energy?
  2. Which package, used in applications needing high reliability such as space, seals its interior with ceramic or metal?
  3. Which surface-mount package has gull-wing leads coming out of two sides?
  4. In high-pin-count QFPs, which problem tends to occur if the lead pitch is made too narrow?
  5. Which method bonds chips to substrates one at a time while heating and applying pressure, and is used to connect thin chips with large warpage and fine-pitch bumps?