Packaging and assembly

In high-power processor packages, what is the metal plate placed on top of the chip to spread heat called?

  1. ALead frame
  2. BHeat spreader (lid)
  3. CProbe card
Show answer and explanation

Answer: B. Heat spreader (lid)

A heat spreader is a metal (mainly copper) plate that spreads heat generated in the chip over a wide area so it transfers more easily to a heat sink above it. It also serves as a lid protecting the chip. A TIM is placed between it and the chip to conduct heat.

Practice this topic Back to topic

More Packaging and assembly questions

  1. Which organic package substrate, used in flip-chip BGAs and similar packages, is made by stacking insulating layers and fine wiring layers?
  2. Which wire bonding method melts the tip of a gold wire with an electrical discharge to form a ball, then bonds it to the electrode with heat and ultrasonic energy?
  3. Which package, used in applications needing high reliability such as space, seals its interior with ceramic or metal?
  4. Which surface-mount package has gull-wing leads coming out of two sides?
  5. In high-pin-count QFPs, which problem tends to occur if the lead pitch is made too narrow?