Packaging and assembly

Which wire bonding method melts the tip of a gold wire with an electrical discharge to form a ball, then bonds it to the electrode with heat and ultrasonic energy?

  1. ABall bonding (thermosonic bonding)
  2. BWedge bonding
  3. CReflow soldering
Show answer and explanation

Answer: A. Ball bonding (thermosonic bonding)

In ball bonding, the tip of the wire fed from a thin tube called a capillary is melted by discharge to form a ball, which is bonded to the chip electrode with heat, pressure and ultrasonic energy. The wire is then looped and pressed flat to bond it on the lead side. It is widely used with gold and copper wire.

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