Packaging and assembly

Which package, used in applications needing high reliability such as space, seals its interior with ceramic or metal?

  1. AResin-molded package
  2. BHermetically sealed package
  3. CTape carrier package
Show answer and explanation

Answer: B. Hermetically sealed package

In a hermetically sealed package, the chip is housed in a ceramic or metal package whose lid is sealed by welding or brazing so that moisture and the like cannot enter. It is more expensive than resin packages but offers excellent moisture resistance and reliability, and is used in space, defense, medical and similar applications.

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More Packaging and assembly questions

  1. Which surface-mount package has gull-wing leads coming out of two sides?
  2. In high-pin-count QFPs, which problem tends to occur if the lead pitch is made too narrow?
  3. Which method bonds chips to substrates one at a time while heating and applying pressure, and is used to connect thin chips with large warpage and fine-pitch bumps?
  4. What is the main purpose of adding large amounts of silica filler to mold resin?
  5. What is the main purpose of placing decoupling capacitors (bypass capacitors) on packages and printed circuit boards?