Packaging and assembly

Which method prints solder paste on a printed circuit board, places components and then heats the board in an oven to solder them?

  1. AWire bonding
  2. BReflow soldering
  3. CFlow (wave) soldering
Show answer and explanation

Answer: B. Reflow soldering

In reflow soldering, solder paste is printed on the board's electrodes, components are placed, and the board is heated in a reflow oven to melt the solder and make the joints. It is the main method for mounting surface-mount components. Passing the board through a wave of molten solder is called flow soldering.

Practice this topic Back to topic

More Packaging and assembly questions

  1. What is the method called that mounts a memory package stacked on top of a processor package?
  2. Which long-established package has two rows of pins along both sides and is mounted by inserting them into holes in the board?
  3. Why does warpage from heating during reflow become a problem for large packages?
  4. For surface-mount packages, which moisture-related rating specifies, among other things, how long they may be left after opening the moisture-proof packing before reflow?
  5. In high-power processor packages, what is the metal plate placed on top of the chip to spread heat called?