Packaging and assembly

What is the method called that mounts a memory package stacked on top of a processor package?

  1. AQFP
  2. BDIP
  3. CPoP (package on package)
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Answer: C. PoP (package on package)

In PoP, another package (such as DRAM) is stacked and soldered on top of the lower package (such as a processor). It reduces mounting area on the board and shortens wiring, so it is widely used in smartphones and similar devices.

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More Packaging and assembly questions

  1. Which long-established package has two rows of pins along both sides and is mounted by inserting them into holes in the board?
  2. Why does warpage from heating during reflow become a problem for large packages?
  3. For surface-mount packages, which moisture-related rating specifies, among other things, how long they may be left after opening the moisture-proof packing before reflow?
  4. In high-power processor packages, what is the metal plate placed on top of the chip to spread heat called?
  5. Which organic package substrate, used in flip-chip BGAs and similar packages, is made by stacking insulating layers and fine wiring layers?