Interconnect processes

What is the time-dependent dielectric breakdown of the insulator between wires called, which is becoming more important as wire spacing shrinks?

  1. ABEOL TDDB (inter-wire TDDB)
  2. BNBTI
  3. CHCI
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Answer: A. BEOL TDDB (inter-wire TDDB)

As wire spacing narrows, the electric field across the insulator between wires increases, and long-term use can cause dielectric breakdown. Low-k films in particular tend to have lower dielectric strength than conventional oxide, so BEOL TDDB has become an important item in evaluating wiring reliability.

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More Interconnect processes questions

  1. What is the main role of the wiring inside an LSI?
  2. Which correctly describes "multilevel wiring" in an LSI?
  3. Which is closest to the resistivity of copper (Cu) at room temperature? (Bulk value)
  4. Which set correctly lists the main properties required of LSI wiring materials?
  5. What is the basic role of the interlayer dielectric that fills the space between wires?