Interconnect processes

Which correctly describes "multilevel wiring" in an LSI?

  1. AWiring arranged in a single flat layer
  2. BMany layers of wiring stacked with insulating films between them and connected between layers by vias
  3. CSending signals wirelessly without wiring
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Answer: B. Many layers of wiring stacked with insulating films between them and connected between layers by vias

In multilevel wiring, wiring layers and insulating films alternate, and wires in upper and lower layers are connected by vertical connections called vias. This lets the enormous number of connections that could not fit in one plane be arranged efficiently in three dimensions.

  • A. A single layer cannot connect a large number of devices.
  • B. Correct. Many layers are stacked with insulators between and connected by vias.
  • C. Wiring inside an LSI is wired metal, not wireless.
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More Interconnect processes questions

  1. Which is closest to the resistivity of copper (Cu) at room temperature? (Bulk value)
  2. Which set correctly lists the main properties required of LSI wiring materials?
  3. What is the basic role of the interlayer dielectric that fills the space between wires?
  4. Why has an Al-Cu alloy with about 0.5% copper been used for aluminum wiring?
  5. What is the phenomenon called in which electroplated Cu films, simply left at room temperature, grow larger grains over time and drop in resistivity?