Advanced packaging (3D and chiplets)

What is the main aim of products that stack a cache SRAM chip on top of a processor chip with hybrid bonding?

  1. ATo change the chip's color
  2. BTo boost performance by placing a large cache close by without enlarging the processor
  3. CTo raise the processor's supply voltage
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Answer: B. To boost performance by placing a large cache close by without enlarging the processor

A larger cache cuts memory accesses and raises performance, but SRAM takes a lot of area. Stacking an SRAM chip directly on top of the processor connects a large cache over a very short distance without enlarging the processor chip. Performance improves in uses where cache capacity matters, such as games.

  • A. It is not for changing color.
  • B. Correct. Stacking puts a large cache close by.
  • C. It is not for raising the supply voltage.
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More Advanced packaging (3D and chiplets) questions

  1. Which method is used to make silicon interposers larger than the maximum area a lithography tool can expose at once (about 26 mm × 33 mm)?
  2. Which correctly explains how copper electrodes are joined to each other in copper-dielectric hybrid bonding?
  3. In classifying TSVs by when they are formed, which approach makes TSVs after forming transistors but before forming the multilayer interconnect?
  4. Which pair of typical pitches (terminal spacing) for chip-to-chip connections is most appropriate?
  5. In manufacturing fan-out wafer-level packages, what is the problem called in which chips shift position because of resin flow or shrinkage during curing when they are encapsulated?