A large metal area on the underside of packages such as QFN, connected to the die pad. Soldered to the board, it is the main path for removing heat and is usually tied to inner-layer planes with thermal vias.
Japanese name: 露出パッド(エクスポーズドパッド)
Exposed pad appears in 2 practice questions across 1 topic, including How to read datasheets.
Field: How to read datasheets
Answer: C. Provide a land on the board, solder the pad, connect it to the specified potential (often GND) and conduct heat away through thermal vias
The exposed pad is the underside of the die pad, on which the chip is mounted, exposed outside the package; it is the main path for heat into the board. The datasheet θJA value is typically measured with this pad soldered to the board and connected to inner-layer planes through thermal vias, and leaving it unsoldered greatly degrades heat dissipation. The recommended land pattern may also show the stencil aperture divided into segments to adjust the solder volume and prevent voids and component lifting. Follow the datasheet for the potential to connect it to.
The exposed pad is the underside of the die pad, on which the chip is mounted, exposed outside the package; it is the main path for heat into the board.
Which is the common way to handle the large exposed pad on …Much of the heat flows from the package through the pins and the exposed pad on the bottom into the board, so θJA depends strongly on the board.
Which is a correct caution when using the θJA (junction-to-…As an Amazon Associate I earn from qualifying purchases.
Thermal resistance 5 V tolerant Absolute maximum ratings Allowable power dissipation Derating Dropout voltage Errata Input offset voltage MSL (moisture sensitivity level) Noise margin