Testing and inspection

In logic testing, which pair correctly names the test that exhaustively detects structural faults (such as stuck-at faults) using scan and similar, and the test that checks function as in actual operation?

  1. ADC test and AC test
  2. BWafer test and burn-in
  3. CStructural test and functional test
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Answer: C. Structural test and functional test

A structural test applies fault models to the circuit's structure and efficiently detects faults in each part, using scan and the like. A functional test applies inputs close to real usage and checks that the chip functions to specification. The two are combined to ensure quality.

  • A. DC and AC tests examine DC characteristics and AC characteristics such as timing.
  • B. Wafer test and burn-in are distinguished by test stage and type.
  • C. Correct. They are structure-based and function-based tests.
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More Testing and inspection questions

  1. What is it called when good chips are judged defective and discarded because test limits are too strict or measurements are unstable?
  2. In memory testing, what is the main purpose of making a map recording which bits at which addresses failed?
  3. When compressing scan test outputs, why must signals whose value (0 or 1) is undetermined in simulation (unknowns, X) be removed?
  4. In testing high-speed serial interfaces, which method loops the chip's transmitter output back to its receiver so the chip itself verifies communication?
  5. What is the technique called that dynamically changes test items or limits per chip or per lot based on intermediate results and statistics, such as from wafer test?