Testing and inspection

What is KGD (Known Good Die), which is important when mounting several chips in one package?

  1. AA large chip
  2. BA failed chip
  3. CA chip (die) confirmed to be good before mounting
Show answer and explanation

Answer: C. A chip (die) confirmed to be good before mounting

When several chips are built into one package, a single defective chip makes the whole package defective, including the good chips. It is therefore important to test thoroughly at the die stage before mounting and use KGD confirmed to be good.

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More Testing and inspection questions

  1. What is the technique called in which a tester measures several chips simultaneously to lower test cost?
  2. What is it called to automatically generate test patterns that detect faults from a circuit's netlist?
  3. What is the test called that measures the supply current of a CMOS circuit in a quiescent state to detect defects such as bridging faults?
  4. What is the main use of boundary scan, specified in IEEE 1149.1 (JTAG)?
  5. In final test after packaging, which machine works with the tester to feed ICs automatically and sort them according to test results?