Testing and inspection

Which correctly describes the purpose of burn-in?

  1. ATo inspect the appearance of chips
  2. BTo apply stresses such as high temperature and voltage to remove products prone to early failure before shipment
  3. CTo measure film thickness on wafers
Show answer and explanation

Answer: B. To apply stresses such as high temperature and voltage to remove products prone to early failure before shipment

Burn-in operates products for a set time under conditions such as high temperature and high voltage, causing products with latent defects to fail early so they can be removed (screened). Its purpose is to reduce, before shipment, the failures that would occur in the early-failure period of the bathtub curve.

Practice this topic Back to topic

More Testing and inspection questions

  1. Which correctly describes scan design, a form of design for testability (DFT)?
  2. Which items are mainly checked in a semiconductor DC test?
  3. Which correctly describes BIST (built-in self-test)?
  4. Which correctly describes a probe card?
  5. Which correctly describes the stuck-at fault model used in testing logic circuits?