Packaging and assembly

What is the main purpose of heating packages in an oven for some time after molding (post-mold cure)?

  1. ATo melt and remove the resin
  2. BTo recrystallize the chip
  3. CTo complete the curing of the molding compound and stabilize properties such as strength and moisture resistance
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Answer: C. To complete the curing of the molding compound and stabilize properties such as strength and moisture resistance

Because the resin is heated only briefly during molding, its curing reaction is not complete. Heating in an oven for a set time after molding advances the cure, stabilizing mechanical strength, moisture resistance, glass transition temperature and other properties.

  • A. It is not a process for removing resin.
  • B. It is not a process for recrystallizing the chip.
  • C. Correct. It advances the cure and stabilizes properties.
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More Packaging and assembly questions

  1. What is the defect called in which bonding wires are pushed aside and deformed by the resin flow during molding?
  2. What change occurs when the temperature of a molding compound exceeds its glass transition temperature (Tg)?
  3. Which method makes very thin chips by first cutting grooves partway into the wafer from the front and then grinding the back to separate the chips?
  4. In dense assemblies such as smartphones, what is the purpose of forming a metal film on the package surface by sputtering or similar?
  5. In reflow, what is the defect called in which one end of a small part such as a chip resistor lifts up so the part stands on end?