Packaging and assembly

What is the main purpose of adding large amounts of silica filler to mold resin?

  1. ATo lower the coefficient of thermal expansion and reduce the mismatch with the chip
  2. BTo color the resin
  3. CTo make the resin electrically conductive
Show answer and explanation

Answer: A. To lower the coefficient of thermal expansion and reduce the mismatch with the chip

Epoxy resin has a large coefficient of thermal expansion; on its own the mismatch with the silicon chip is large, so temperature changes strain the chip or cause delamination and cracks. Adding large amounts of low-expansion silica filler lowers the mold resin's coefficient of thermal expansion.

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