Lithography

What is the typical reduction ratio when today's exposure tools (scanners) project the mask pattern onto the wafer?

  1. A1:1
  2. B1/4
  3. C1/100
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Answer: B. 1/4

Today's exposure tools typically project the mask pattern onto the wafer at 1/4 size. Mask features can be four times larger than on the wafer, making masks easier to make and reducing the impact of small mask defects.

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  1. Which is a characteristic of scanner-type exposure tools?
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