Lithography

Which is the correct general order of lithography steps?

  1. AExposure → resist coating → development → pre-bake
  2. BResist coating → pre-bake → exposure → post-exposure bake → development
  3. CDevelopment → exposure → resist coating → etching
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Answer: B. Resist coating → pre-bake → exposure → post-exposure bake → development

First, resist is coated and solvent is driven off in a pre-bake. Next comes exposure, and for chemically amplified resists a post-exposure bake (PEB) drives the reaction. Finally, development forms the pattern, followed by a post-bake to harden it if needed. Coating through development is done in a coater/developer connected to the exposure tool.

Lithography and etching steps (positive resist) Resist Film to etch Substrate Mask Exposed area ① Coat ② Expose ③ Develop ④ Etch ⑤ Strip
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More Lithography questions

  1. What is the technique called that transfers a pattern by pressing a mold with fine patterns into resist?
  2. Which equipment is mainly used to write the patterns of photomasks (reticles)?
  3. What is the role of the thin membrane (pellicle) stretched over a photomask at a fixed distance?
  4. What is the main purpose of the bottom anti-reflective coating (BARC) applied under resist?
  5. Which correctly describes 'High-NA EUV', developed as the next-generation EUV exposure tool?