Deposition (CVD and PVD)

What is the method called that sputters a titanium target in a nitrogen-containing gas to form titanium nitride (TiN) films?

  1. AVacuum evaporation
  2. BReactive sputtering
  3. CIon implantation
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Answer: B. Reactive sputtering

Reactive sputtering adds a reactive gas such as nitrogen or oxygen to argon during sputtering, so the metal ejected from the target reacts with the gas to form nitride or oxide films. TiN is used for barrier layers, hard masks, metal gates and more.

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More Deposition (CVD and PVD) questions

  1. What is an advantage of plasma-enhanced ALD (PEALD)?
  2. In CVD equipment, which component supplies source gas uniformly over the wafer through many small holes?
  3. Which deposition method fills very narrow, deep trenches from the bottom with a flowable film and then solidifies it?
  4. What is generally done to increase the deposition rate in sputtering?
  5. For films of the same material, in what way are high-temperature thermal CVD films generally better than plasma CVD films?