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Automotive Semiconductors and Functional Safety

Which correctly describes the difference between component-level ESD tests of ICs (HBM and CDM) and system-level ESD tests performed on finished automotive equipment?

  1. AThe two use the same conditions, so if the IC passes the component-level test, no protection components need to be added to the equipment's board
  2. BComponent-level tests assume handling during manufacturing and assembly, while system-level tests assume cases such as a person touching the equipment in use, with much higher discharge energy
  3. CSystem-level tests have lower discharge energy, so they are always easier to pass than component-level tests
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Answer: B. Component-level tests assume handling during manufacturing and assembly, while system-level tests assume cases such as a person touching the equipment in use, with much higher discharge energy

HBM and CDM are tests that assume static electricity when ICs are handled in controlled factories; an HBM rating of around 2 kV, for example, is one common benchmark. System-level tests, which assume discharges such as from a person touching a door or switch, use high voltages from a few kV to more than 10 kV (up to about 25 kV for air discharge), with much higher discharge energy. The IC's internal protection circuits alone often cannot withstand this, so protection components such as TVS diodes are added on the board at externally connected pins.

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