nMOS vs pMOS: Key Differences Explained
An nMOS is a MOSFET in which electrons flow through the channel, and a pMOS is one in which holes do; all the voltage polarities are reversed. An nMOS turns on when the gate is raised above the source, and a pMOS turns on when the gate is lowered below the source. In silicon, electron mobility is about 2–3 times hole mobility, so for the same dimensions an nMOS can carry more current. In CMOS circuits, the nMOS pulls the output to ground and the pMOS pulls it to the supply, and the pMOS gate is made wider to match the drive strength.
| Aspect | nMOS | pMOS |
|---|---|---|
| Structure | n⁺ source and drain in a p-type substrate or p-well | p⁺ source and drain in an n-well |
| Channel carriers | Electrons | Holes |
| Mobility (silicon inversion layer) | High. About 2–3 times that of holes | Low |
| Threshold voltage (enhancement mode, referenced to source) | Positive (e.g. +0.3 V) | Negative (e.g. −0.3 V) |
| Turn-on condition | VGS > Vth. Raise the gate above the source | VGS < Vth (negative). Lower the gate below the source by at least |Vth| |
| Source connection in CMOS | Ground side | Supply (VDD) side |
| Role in CMOS | Pull-down. Pulls the output to ground. In series in NAND, in parallel in NOR | Pull-up. Pulls the output to the supply. In parallel in NAND, in series in NOR |
| Value passed well as a switch | Passes 0 well. A 1 rises only to about VDD − Vth | Passes 1 well. A 0 falls only to about |Vth| |
| Gate width needed for equal drive | Reference (1×) | Typically about 2–3 times that of the nMOS |
| Strain that boosts mobility | Tensile strain (stress liners, Si:C source/drain, etc.) | Compressive strain (SiGe source/drain, etc.) |
| Typical degradation | PBTI (a concern with high-k/metal gates) | NBTI |
Figures are typical orders of magnitude and vary by process generation and product.