Silicon wafers

Along which crystal planes does single-crystal silicon cleave most easily?

  1. A{100} planes
  2. B{111} planes
  3. C{110} planes
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Answer: B. {111} planes

Silicon cleaves most easily along {111} planes. A (100) wafer tends to break along {111} planes inclined to the surface or {110} planes perpendicular to it, and the straight fracture lines can even be used to infer the wafer's crystal orientation.

  • A. {100} is the surface plane of a (100) wafer, not the easiest cleavage plane.
  • B. Correct. Silicon cleaves most easily along {111}.
  • C. Silicon also cleaves along {110}, but {111} is the easiest.
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  1. Which method is most widely used to produce single-crystal silicon for LSIs?
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  3. Which is a characteristic of single-crystal silicon made by the FZ (floating zone) method?
  4. What is the main role of the notch (small cutout) on the edge of a silicon wafer?
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