Silicon wafers

Which method is most widely used to produce single-crystal silicon for LSIs?

  1. ACzochralski (CZ) method
  2. BSol-gel method
  3. CElectrolytic refining
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Answer: A. Czochralski (CZ) method

In the CZ method, a seed crystal is dipped into silicon melted in a quartz crucible and slowly pulled up while rotating, producing a large single-crystal ingot. It is well suited to large diameters, and most LSI wafers are made this way.

Pulling a single crystal by the Czochralski (CZ) method Pulled up while rotating Seed crystal Single crystal Molten silicon Quartz crucible Heater
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More Silicon wafers questions

  1. Which wafer diameter is currently mainstream in leading-edge logic and memory production lines?
  2. Which is a characteristic of single-crystal silicon made by the FZ (floating zone) method?
  3. What is the main role of the notch (small cutout) on the edge of a silicon wafer?
  4. Which correctly describes gettering?
  5. Which impurity is incorporated in relatively large amounts from the crucible into silicon crystals grown by the CZ method?