Silicon wafers

Which correctly describes 450 mm wafers, developed as the next diameter after 300 mm?

  1. AThey are already mainstream in production lines
  2. BThey are smaller than 200 mm
  3. CPartly because equipment development required huge investment, the full transition to mass production has not happened
Show answer and explanation

Answer: C. Partly because equipment development required huge investment, the full transition to mass production has not happened

The industry worked on 450 mm wafers in the 2010s, but developing equipment and building fabs required huge investment and the benefits did not appear to justify the cost, among other reasons, so a full transition to mass production has not happened. 300 mm remains mainstream for leading-edge production.

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More Silicon wafers questions

  1. What is the purpose of using bulk microdefects (BMDs), formed by oxygen precipitation inside CZ wafers?
  2. Heat treatment of a wafer diffuses oxygen out from near the surface, creating a low-defect layer at the surface where devices are made. What is this layer called?
  3. What is the purpose of the laser mark (ID mark) inscribed on the front or back of a wafer?
  4. Which polishing method is common for 300 mm wafers?
  5. What is a used monitor wafer called after its surface films are removed and it is repolished for reuse?