Process materials (gases and chemicals)

Which is a typical material used for low-k interlayer dielectrics?

  1. ACarbon-containing silicon oxide (SiOC) films
  2. BCopper
  3. CTitanium nitride
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Answer: A. Carbon-containing silicon oxide (SiOC) films

Low-k films widely use SiOC (carbon-doped oxide), in which carbon or methyl groups are incorporated into silicon oxide to lower the dielectric constant. Porous films with fine voids are also used to lower it further, but reduced mechanical strength is a challenge.

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