Process materials (gases and chemicals)

What is the main composition of the plating bath used to electroplate copper wiring?

  1. AMainly copper sulfate, with additives that control filling
  2. BAqueous sodium chloride
  3. COnly deionized water
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Answer: A. Mainly copper sulfate, with additives that control filling

Copper plating baths consist mainly of copper sulfate and sulfuric acid, with chloride ions and organic additives such as accelerators, suppressors and levelers. The additives make copper grow preferentially from the bottom of trenches (bottom-up growth), achieving void-free filling.

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