Packaging and assembly

What is the common step for displaying the part name, lot number and similar on the package surface of a finished IC?

  1. AEpitaxial growth
  2. BMarking, such as by laser
  3. CIon implantation
Show answer and explanation

Answer: B. Marking, such as by laser

Product name, lot number, date code and the like are displayed on the package surface by laser-burning the resin surface or printing with ink. This is called marking and is used for product identification and traceability.

  • A. Epitaxial growth grows crystal on the wafer.
  • B. Correct. It is marked by laser or similar.
  • C. Ion implantation introduces impurities into the wafer.
Practice this topic Back to topic

More Packaging and assembly questions

  1. What is the typical diameter of wires used in wire bonding?
  2. What is the packing format called in which surface-mount ICs are placed one by one in pockets in a tape and wound up, to be fed to placement machines?
  3. What is the main advantage of surface mounting compared with inserting leads into holes in the PCB?
  4. In leadframe packages, what is the main purpose of plating the exposed leads with tin (Sn)-based plating?
  5. In reflow with lead-free solder (Sn-Ag-Cu), which is closest to the peak temperature that parts experience?