Packaging and assembly

What is the packing format called in which surface-mount ICs are placed one by one in pockets in a tape and wound up, to be fed to placement machines?

  1. AWafer cassette
  2. BTape and reel
  3. CFOUP
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Answer: B. Tape and reel

In tape and reel, parts are placed in pockets in a carrier tape, sealed with a cover tape and wound onto a reel. The reel mounts directly on PCB placement machines, which feed parts automatically one after another.

  • A. A wafer cassette holds wafers in a row.
  • B. Correct. Parts are packed in tape wound on a reel.
  • C. A FOUP is a sealed container for moving wafers within the fab.
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More Packaging and assembly questions

  1. What is the main advantage of surface mounting compared with inserting leads into holes in the PCB?
  2. In leadframe packages, what is the main purpose of plating the exposed leads with tin (Sn)-based plating?
  3. In reflow with lead-free solder (Sn-Ag-Cu), which is closest to the peak temperature that parts experience?
  4. Which dicing method, with almost no kerf loss, focuses a laser inside the wafer to create a modified layer and then separates chips by stretching the tape?
  5. Which package has flat electrodes (lands) arranged in a grid on its bottom instead of solder balls?