Lithography

In current scanner exposure tools, what is the typical maximum area on the wafer that can be exposed in one exposure (one shot)?

  1. AThe whole wafer (300 mm diameter)
  2. BAbout 1 mm × 1 mm
  3. CAbout 26 mm × 33 mm
Show answer and explanation

Answer: C. About 26 mm × 33 mm

A typical scanner exposes an area of about 26 mm × 33 mm on the wafer in one shot and repeats while moving the wafer to cover it all. This size sets the practical maximum chip size; larger chips must stitch multiple shots. High-NA EUV halves this field.

  • A. The whole wafer is not exposed at once.
  • B. About 1 mm square is too small.
  • C. Correct. About 26 mm × 33 mm is typical.
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More Lithography questions

  1. Which technique uses computation to jointly optimize the illumination shape of the exposure tool and the mask pattern to improve resolution?
  2. In immersion lithography with very high numerical aperture (NA), why does light polarization need to be considered?
  3. What is the main cause of "flare", a problem in EUV lithography?
  4. In EUV masks, what is the phenomenon called in which the absorber pattern's thickness is not negligible compared with the wavelength, so obliquely incident light casts shadows and otherwise affects the image?
  5. What are the weak spots in a layout called, which lithography or process simulation predicts are prone to patterns bridging or breaking?