Lithography

Which correctly describes photoresist?

  1. AAn adhesive for holding wafers in place
  2. BA metal used for wiring
  3. CA photosensitive material whose properties change when exposed to light, becoming more or less soluble in developer
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Answer: C. A photosensitive material whose properties change when exposed to light, becoming more or less soluble in developer

Photoresist is a photosensitive resin whose chemical properties change with light (exposure). In positive resist the exposed areas dissolve in the developer, while in negative resist the exposed areas remain. This is how the mask pattern is transferred.

  • A. It is not an adhesive.
  • B. Resist is a resin, not a wiring metal.
  • C. Correct. It is a photosensitive material whose properties change with light.
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More Lithography questions

  1. Which company is effectively the sole supplier of EUV lithography tools?
  2. What is the wavelength of the light used in KrF excimer laser lithography?
  3. What is the main purpose of treating the wafer surface with HMDS or similar before coating resist?
  4. What does "half-pitch", used as a measure of scaling, mean?
  5. What are the reference marks placed on a wafer so that each exposure can be accurately overlaid on patterns made in earlier steps called?