Lithography

What is the main purpose of the bottom anti-reflective coating (BARC) applied under resist?

  1. ATo speed up etching
  2. BTo suppress standing waves in the resist and dimensional variation caused by reflection from the underlying layers
  3. CTo bond the resist to the wafer
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Answer: B. To suppress standing waves in the resist and dimensional variation caused by reflection from the underlying layers

When exposure light passes through the resist and reflects from underlying layers, it interferes with the incoming light, creating standing waves in the resist, and topography in the underlying layers causes dimensional variation. BARC suppresses reflection from below and improves dimensional accuracy.

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More Lithography questions

  1. Which correctly describes 'High-NA EUV', developed as the next-generation EUV exposure tool?
  2. Which metric describes nanometer-scale roughness on the sidewalls of fine resist patterns?
  3. Which correctly describes the factor k1 in the resolution formula R = k1 × λ / NA?
  4. What is the main cause of the stochastic fluctuations that are a problem in EUV lithography?
  5. Why are defects buried inside the multilayer of an EUV mask a problem?