Yield and quality control

Which type of control automatically adjusts equipment processing conditions for the next lot or wafer based on, for example, measurement results from earlier steps?

  1. AFMEA
  2. BPareto analysis
  3. CAPC (run-to-run control, etc.)
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Answer: C. APC (run-to-run control, etc.)

APC (Advanced Process Control) uses measurement data to adjust equipment conditions automatically, reducing process variation. For example, etch or CMP time is corrected based on film thickness measured in an earlier step. It is used as a method of actively correcting the process, in addition to SPC monitoring with control charts.

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More Yield and quality control questions

  1. Which technique identifies possible failure modes in a product or process, evaluates their effects and severity, and takes countermeasures in advance?
  2. Which chart plots pairs of two characteristic values to examine their correlation?
  3. What is it called that shows yield improving over time as defect causes are analyzed and addressed after a new process is launched?
  4. What is the purpose of evaluating manufacturing variation separately by factor, such as lot-to-lot, wafer-to-wafer and within-wafer?
  5. Which correctly describes the idea behind the quality management activity called 'Six Sigma'?