Silicon wafers

Which polishing method is common for 300 mm wafers?

  1. APolishing both front and back to achieve high flatness
  2. BPolishing only one side and leaving the back rough
  3. CNo polishing
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Answer: A. Polishing both front and back to achieve high flatness

To meet strict flatness requirements, 300 mm wafers are commonly double-side polished, polishing front and back simultaneously. The front is then finish-polished to a mirror surface. Because the back is also smooth, deformation when chucked on stages and particle generation are reduced.

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