MOSFET

For a typical MOSFET in an integrated circuit, which statement about the source and drain is correct?

  1. AThe structure is nearly symmetric, and which side acts as the source depends on the potentials
  2. BThe source always has a higher impurity concentration than the drain
  3. CThe source and drain are made of different semiconductor materials
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Answer: A. The structure is nearly symmetric, and which side acts as the source depends on the potentials

In a typical integrated-circuit MOSFET, the source and drain are diffusion regions with the same structure and are nearly symmetric. In an nMOS device, the side at lower potential acts as the source and the higher side as the drain. The current direction can even reverse, as in a transmission gate.

  • A. Correct. The structure is symmetric, and the potentials decide the roles.
  • B. In an ordinary MOSFET, the source and drain have the same doping.
  • C. The source and drain are made of the same material in the same process step.
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More MOSFET questions

  1. What is the condition for a long-channel nMOSFET to operate in the saturation region? (Assume VGS > Vth.)
  2. How does the threshold voltage change when the impurity concentration of the channel region (p-type substrate) of an nMOSFET is increased?
  3. If the gate insulator of an nMOSFET is made thicker with all else unchanged, how does the magnitude of the threshold voltage generally change?
  4. Which generally describes the relationship between a MOSFET's gate length (the length of the gate electrode on the mask or after patterning) and its effective channel length?
  5. Which correctly describes punch-through in a MOSFET?