MEMS and sensors

What is the method called that bonds silicon and glass by applying voltage while heating, used for MEMS sealing and similar purposes?

  1. AAnodic bonding
  2. BWire bonding
  3. CSputtering
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Answer: A. Anodic bonding

In anodic bonding, glass containing sodium or similar ions is placed on silicon, heated to several hundred °C, and a voltage is applied with the glass side negative. Ions in the glass move, creating strong electrostatic attraction at the interface, and chemical bonds form a strong bond. It is used for pressure sensors and sealing.

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