Epitaxial growth

In epitaxial structures for GaN HEMTs, what is the main purpose of adding carbon or iron to the GaN buffer layer beneath the channel?

  1. ATo make it emit light
  2. BTo make the buffer highly resistive, suppressing off-state leakage and short-channel effects
  3. CTo make the buffer low-resistance so current flows easily
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Answer: B. To make the buffer highly resistive, suppressing off-state leakage and short-channel effects

GaN tends to become n-type because of unintentionally incorporated donors, and current flowing through the buffer makes the device hard to turn off. Adding carbon or iron lets deep levels capture electrons, making the buffer highly resistive. However, trapped charge can cause a temporary drop in current (current collapse), so the doping level must be tuned.

  • A. It is not intended to produce light.
  • B. Correct. It makes the buffer resistive to suppress leakage.
  • C. The purpose is the opposite: to make the buffer highly resistive.
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More Epitaxial growth questions

  1. When a polar compound semiconductor such as GaAs is grown on a non-polar silicon substrate, what is the boundary called between regions in which the Ga and As positions are inverted?
  2. In SiC epitaxy, what is the phenomenon called in which many atomic surface steps gather into large steps, roughening the surface?
  3. Which correctly describes epitaxial growth?
  4. Which is an example of heteroepitaxial growth?
  5. What is MOCVD (metal-organic chemical vapor deposition) mainly used for?