LSI design flow and EDA

Why is static timing analysis performed under multiple conditions combining process variation, supply voltage and temperature?

  1. ATo shorten analysis time
  2. BTo confirm that timing is met under all conditions even as manufacturing variation and operating environment change
  3. CTo reduce layout area
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Answer: B. To confirm that timing is met under all conditions even as manufacturing variation and operating environment change

Transistor speed varies with manufacturing variation (Process), supply voltage (Voltage) and temperature (Temperature). Setup violations are more likely under slow conditions and hold violations under fast conditions, so analysis is done at multiple PVT corners to confirm correct operation under every condition.

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More LSI design flow and EDA questions

  1. What is the step called that extracts wire resistance and capacitance from the layout after place and route?
  2. In verifying large SoCs, which technique runs the designed circuit on dedicated hardware or FPGAs and verifies it quickly together with software?
  3. What is it called to hand over the data for mask making to manufacturing after design and verification are complete?
  4. In the final check before tape-out (sign-off), which power-network analysis is performed alongside timing verification?
  5. Which design philosophy refines layouts and the like to make them less susceptible to manufacturing variation and defects?