Deposition (CVD and PVD)

In CVD, what is the phenomenon called in which more source gas is consumed and the deposition rate drops as the area of wafers or patterns being coated increases?

  1. AElectromigration
  2. BLoading effect
  3. CChanneling
Show answer and explanation

Answer: B. Loading effect

In CVD, a larger reacting surface area consumes more source gas, and the deposition rate drops where supply cannot keep up. This dependence of deposition rate on the number of wafers or the exposed pattern area is called the loading effect and affects film thickness uniformity.

  • A. Electromigration is the movement of wiring metal atoms caused by current.
  • B. Correct. It is the drop in rate from source consumption.
  • C. Channeling is ions traveling deep along crystal channels during implantation.
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More Deposition (CVD and PVD) questions

  1. In reactive sputtering, what is the phenomenon called in which, with too much reactive gas flow, the target surface becomes covered with a compound and the deposition rate drops sharply?
  2. Which method is used to tune the stress of plasma CVD silicon nitride from compressive to tensile?
  3. Into which category does deposition by sputtering fall?
  4. Which is a characteristic of ALD (atomic layer deposition)?
  5. What is the main advantage of plasma CVD (PECVD)?