Deposition (CVD and PVD)

In deposition and etching equipment, which mechanism holds the wafer on the stage by electrostatic force?

  1. AVacuum tweezers
  2. BElectrostatic chuck (ESC)
  3. CFOUP
Show answer and explanation

Answer: B. Electrostatic chuck (ESC)

An electrostatic chuck applies voltage to electrodes inside the stage, and the electrostatic force between them and the wafer holds the wafer in place. It works in vacuum and holds the entire wafer uniformly, which also makes wafer temperature easier to control.

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More Deposition (CVD and PVD) questions

  1. Which pair of source gases is used to deposit silicon nitride (Si3N4) by thermal CVD?
  2. What is the method called that sputters a titanium target in a nitrogen-containing gas to form titanium nitride (TiN) films?
  3. What is an advantage of plasma-enhanced ALD (PEALD)?
  4. In CVD equipment, which component supplies source gas uniformly over the wafer through many small holes?
  5. Which deposition method fills very narrow, deep trenches from the bottom with a flowable film and then solidifies it?