CMP and cleaning

What is the approximate size of the abrasive particles in CMP slurries?

  1. AA few mm
  2. BA few cm
  3. CTens to over a hundred nm
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Answer: C. Tens to over a hundred nm

CMP slurry particles are very fine, from tens to over a hundred nm. Particles that are too large cause scratches, so the particle size distribution and the presence of large agglomerates are strictly controlled.

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More CMP and cleaning questions

  1. What is the main purpose of diluting chemicals or using functional water in recent cleaning processes?
  2. What is the main purpose of cleaning the back and edge (bevel) of wafers?
  3. What is the main reason wafer cleaning is considered important in semiconductor manufacturing?
  4. Which correctly describes how many times cleaning is performed across the whole LSI manufacturing flow?
  5. Which set correctly lists the kinds of surface contamination removed from wafers by cleaning?