Chip terms in the news
Semiconductor terms that have been in the news, newest first. Each term page shows when and why it made headlines, with dates, then explains how it works, how it differs from existing technology, and ends with a quick check question.
- RapidusApril 2025 – October 2026Rapidus is a semiconductor manufacturer that aims to mass-produce leading-edge 2 nm-generation logic chips in Japan. It began prototyping at its fab in Chitose, Hokkaido, in 2025 and plans to start volume production in 2027.
- ChipletMarch 2022 – April 2026Chiplets are a way of building a product from small chips split up by function and connected inside one package, instead of one large chip. Because they help with yield and cost, they are used in AI processors and PC CPUs.
- HBMApril 2025 – February 2026HBM is memory made by stacking several DRAM dies and connecting them to the processor through a very large number of wires. It is used in AI GPUs and similar chips to read and write large amounts of data at high speed.
- Backside power delivery (BSPDN)April 2024 – January 2026Backside power delivery (BSPDN) moves the power wiring that feeds the transistors to the back of the wafer. It frees the front-side wiring for signals and reduces voltage drop, and it is starting to be adopted at generations around 2 nm and beyond.
- 2nm generation (GAA transistors)June 2022 – January 2026The 2 nm generation is where the transistor structure switches from FinFET to GAA (gate-all-around). By surrounding the channel with the gate on all sides, it keeps the current reliably switchable on and off even as devices shrink further.
"Why it is in the news" lists only facts we could confirm from announcements and reports, each with its date. The sources are linked on each page.