Reliability

Which correctly describes electromigration?

  1. AA phenomenon in which wiring corrodes due to moisture
  2. BA phenomenon in which current moves metal atoms in wiring, creating voids and hillocks
  3. CA phenomenon in which electrostatic discharge destroys devices
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Answer: B. A phenomenon in which current moves metal atoms in wiring, creating voids and hillocks

Electromigration is a phenomenon in which electrons flowing through wiring collide with metal atoms, transferring momentum and gradually moving them. Voids form where atoms leave, causing open circuits, and hillocks form where atoms accumulate, causing shorts to adjacent wires. It occurs more readily at higher current densities and temperatures.

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More Reliability questions

  1. Which correctly describes MTBF (mean time between failures)?
  2. In accelerated tests that raise temperature to shorten life test time, which model is often used to express the relationship between temperature and lifetime?
  3. Which correctly describes TDDB (time-dependent dielectric breakdown)?
  4. What does the failure-rate unit FIT mean?
  5. Which failures are mainly evaluated by temperature cycling tests?