Power semiconductors

In SiC power modules operating at high temperatures, which material is sometimes used instead of solder to bond the chips?

  1. ASintered silver (a bonding material made by sintering silver nanoparticles and the like)
  2. BEpoxy resin
  3. CRubber
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Answer: A. Sintered silver (a bonding material made by sintering silver nanoparticles and the like)

Conventional solder has a low melting point and fatigues easily under repeated use at high temperatures, so it cannot take full advantage of SiC's high-temperature operation. Bonding materials made by heating and pressing fine silver particles to sinter them have a high melting point and good thermal conductivity, so they are used in power modules requiring high temperature and high reliability.

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More Power semiconductors questions

  1. What is the main advantage of raising the switching frequency of a power converter?
  2. In a power device gate drive circuit, what is the effect of increasing the gate resistance?
  3. Which metric indicates how long a power device can withstand a short circuit, such as both upper and lower switches of an inverter turning on at once, without being destroyed?
  4. What is the purpose of providing a short period in which both switches are off (dead time) when switching the upper and lower switches of an inverter?
  5. Which is a known cause of degradation when current flows continuously through the body diode of a SiC MOSFET?