Si vs SiC Power Semiconductors: Properties, Voltage, Losses and Uses Compared
SiC is a wide-bandgap semiconductor with about 3 times the band gap and about 10 times the breakdown field of silicon. For the same voltage rating, its drift layer can be thinner and more heavily doped, which greatly lowers on-resistance and makes fast devices such as MOSFETs and Schottky barrier diodes usable even at high voltages. Silicon, on the other hand, offers cheap, large-diameter wafers and mature manufacturing, so it remains the mainstay for many applications.
| Aspect | Si (silicon) | SiC (silicon carbide) |
|---|---|---|
| Band gap | About 1.12 eV | About 3.26 eV (4H-SiC) |
| Breakdown field | About 0.3 MV/cm | About 3 MV/cm (about 10 times silicon) |
| Thermal conductivity | About 1.5 W/(cm·K) | High (about 3 times silicon) |
| Intrinsic carrier density at room temperature | About 1×10¹⁰ cm⁻³ | Extremely small (on the order of 10⁻⁹ cm⁻³); properties set by doping are easier to maintain even at high temperature |
| Main devices at high voltage | IGBTs; power MOSFETs and superjunction MOSFETs at lower voltages | MOSFETs and Schottky barrier diodes; unipolar devices that do not use minority carriers work even at high voltage |
| Switching loss | IGBT tail current at turn-off adds loss and makes higher frequencies difficult | No tail current and almost no diode reverse recovery, so losses are small and it can run at high frequency |
| Typical voltage ratings | A wide range from tens of volts to several kV (IGBTs for high voltage) | Mainly about 650 V to 3.3 kV |
| High-temperature operation | Junction temperature generally up to about 150–175 °C | The material itself withstands high temperatures; in practice the limit is often set by the reliability of the package, bonding materials and gate oxide |
| Wafers and cost | Large-diameter wafers up to 300 mm are cheap and available, and manufacturing is mature | Mainly 150 mm, with a shift to 200 mm under way. Crystal growth is difficult, so both wafers and chips are expensive |
| Main challenges | Approaching the material's physical limits at high voltage and high frequency | Quality and reliability of the gate oxide interface, body diode degradation from crystal defects, and noise from fast switching |
| Typical uses | Power supplies for home appliances and PCs, industrial inverters, many automotive power circuits | Electric-vehicle traction inverters, on-board chargers, fast chargers, solar inverters, railways |
Figures are typical orders of magnitude and vary by process generation and product.