Oxidation and diffusion

Which equipment is commonly used to thermally oxidize many wafers at once?

  1. AA vertical furnace (diffusion furnace)
  2. BAn ion implanter
  3. CA CMP tool
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Answer: A. A vertical furnace (diffusion furnace)

Thermal oxidation, diffusion and annealing often use vertical furnaces, which heat about 100 wafers together in a quartz tube. They offer high uniformity and process many wafers at once. When short heating is needed, RTP equipment that heats wafers one at a time with lamps is used.

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More Oxidation and diffusion questions

  1. In thermal diffusion, what is the step called that drives dopants deeper after a fixed amount has been introduced at the surface?
  2. How does the thermal oxidation rate of silicon depend on crystal orientation?
  3. What is the main purpose of introducing nitrogen into the gate oxide to make an oxynitride (SiON)?
  4. Why can thermal oxide be used as a mask against dopants during diffusion?
  5. What is the heat treatment called, performed in a hydrogen-containing atmosphere to reduce interface states at the Si/SiO2 interface?