Metrology and analysis

Which tool is widely used to find delamination at interfaces inside a package, such as between molding compound and chip, non-destructively?

  1. AScanning acoustic microscope (SAT)
  2. BElectron-beam writer
  3. CIon implanter
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Answer: A. Scanning acoustic microscope (SAT)

A scanning acoustic microscope (SAT) applies ultrasound to the package in water and images the waves reflected from internal interfaces. At delaminated areas, the air gap reflects sound strongly, so delamination between resin and chip or leadframe, cracks and voids can be found non-destructively.

  • A. Correct. Delamination is found from ultrasonic reflections.
  • B. An electron-beam writer draws patterns.
  • C. An ion implanter introduces impurities.
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  1. Which method evaluates the quality of compound semiconductor wafers and epi layers without contact by shining laser light and measuring the spectrum and intensity distribution of the emitted light?
  2. Compared with bright-field wafer inspection, which images patterns directly, what characterizes dark-field inspection, which captures only scattered light?
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