IDM vs Fabless vs Foundry: Semiconductor Business Models Compared
An IDM (integrated device manufacturer) handles everything from design to manufacturing and sales in-house. A fabless company owns no fabs; it focuses on design and sales and outsources manufacturing to a foundry. A foundry manufactures chips designed by other companies. As building leading-edge fabs and developing process technology have come to require enormous investment, the split between design and manufacturing has spread.
| Aspect | IDM | Fabless | Foundry |
|---|---|---|---|
| Steps handled | All of design, front end, back end and sales (some back-end work may be outsourced) | Design and sales; manufacturing is outsourced | Front-end manufacturing (wafer fabrication), plus some back-end work such as advanced packaging |
| Own fabs | Yes | No | Yes (manufacturing is the core business) |
| What it sells | Its own branded semiconductor products | Its own branded semiconductor products | Manufacturing services; as a rule, no products under its own brand |
| Main investment | Both fabs and R&D | Designers, EDA tools, IP, and mask and prototyping costs; no fab investment | Fabs and process technology development; leading-edge fabs require enormous investment |
| Strengths | Can optimize design and manufacturing together, and makes proprietary processes and supply control easier | No fab fixed costs, resources concentrated on design, and free choice of the most advanced processes | Gathers orders from many customers to keep fabs highly utilized and recover enormous investments |
| Weaknesses | Fab fixed costs weigh heavily when demand falls, and keeping up investment in advanced processes is a big burden | Capacity and pricing depend on foundries, and supply is hard to secure when manufacturing is congested | Exposed to swings in customer demand, and must keep up the race in leading-edge development and capital spending |
| Typical companies | Intel, Samsung Electronics, Texas Instruments, Kioxia | NVIDIA, Qualcomm, AMD, Broadcom, MediaTek | TSMC, UMC, GlobalFoundries, SMIC |
| Common product areas | Memory (DRAM, NAND), analog, power semiconductors, microcontrollers, CPUs | GPUs, smartphone SoCs, communication ICs, FPGAs | Mainly logic chips designed by customers, plus a wide range of other chips |
Figures are typical orders of magnitude and vary by process generation and product.